As far as the crystal is concerned, its orientation should be determined before cutting, and the cutting surface should be determined. When cutting, the saw blade should be fixed first, and the material to be cut should be fixed. Moreover, the damage to the crystal surface caused by the cutting heat can be reduced, and the cutting liquid can also wash the crystal slag in the cutting area.

The cut wafers are to be ground in the next process. First, use a thickness gauge to measure the thickness of the wafers and group them, and stick wafers with similar thicknesses on the carrier block symmetrically. Before bonding, the periphery of the wafer is chamfered. The temperature of the carrier block is not easy to be too high when sticking, as long as the fixing wax is melted, the wafer is best placed on the outermost ring of the carrier block, the sticker should be symmetrical, and the air under the chip should be drained (with iron blocks for compaction). Prevent the generation of non-rotating load blocks and bubble-induced debris. The thickness of the wafer adhered to the carrier block is then measured with a thickness gauge and an initial record is made. The thickness of the thinning is measured in time during the grinding process until the tolerance dimension required by the process is reached.

Before using the grinding and polishing machine, the equipment should be cleaned. At the same time, in order to ensure the flatness of the grinding disc, the grinding disc should be ground before use. When grinding the disc, the dressing ring and the grinding disc should be self-grinding. The same abrasive is used, and the time for each disc repair is about 10 minutes. Only in this way can the surface of the wafer not be damaged during grinding and achieve the ideal grinding effect.

To achieve the ideal grinding effect, grinding tools are also important. TransGrind supply different kinds of diamond tools for concrete and stone grinding and polishing. We have supplied many different kinds of diamond tools for many customers, such as Scanmaskin tools, Lavina tools, Klindex tools, Husqvarna tools, HTC tools etc. Welcome to consult for our products by clicking pictures to get into our official web if you are interested.

Before polishing, check whether the polishing cloth is clean and whether the polishing cloth is sticky and flat. It must be clean and flat. When polishing, the flow rate of the polishing liquid should not be small. The polishing liquid should be fully saturated on the polishing cloth. Generally, the polishing time should be more than one hour. The corrosion rate is greater than the mechanical friction rate, resulting in small pits on the wafer surface.

The cleaning of the equipment is very important. Whether the cleaning is clean will directly affect the quality of grinding and polishing wafers. After each grinding or polishing, carefully clean the equipment inside and out. When the support wheel on the carrier block is rotating, the abrasive can easily enter the wheel, so before each use, be sure to use a brush to clean the residual abrasive in the gap of the support wheel, so that the support wheel can rotate freely. Ensure the flatness of grinding and polishing wafers.

When flushing the equipment, the water flow is not easy to be too large, so as to avoid water entering the inside of the casing and causing a short circuit of the wires.

If your equipment will not be used for a long time, clean the equipment and wipe away the water stains, and coat the cast iron pan with oil to avoid rust.